Wafer/Silicon Wafer/Silicon Dioxide Wafer/High-Purity Polysilicon/Monocrystalline Silicon

• Customization: Available
• After-sales Service: One Year
• Warranty: One Year
• Model NO.: RAY-LH152#
• Usage: Lighting, Medical, Optical, Photography
• Type: Wafer
• Shape: Customized
• Material: Optical Glass
• Lenses Color: Customized
• Certification: RoHS, ISO9001, CE
• Customized: Customized
• Substrate: Schott Borofloat 33 or Equivalent
• Surface Quality: 40-20 Scratch-Dig or Custom Manufacturing
• Surface Flatness: Lambda/10 at 632.8nm with Power Removed
• Coating Type: Dielectric Coating
• Wavelength Range: 488-694 Nm/700-950nm
• Transport Package: Cartons or Wood Case
• Specification: 12.7mm/25.4mm/50.8mm or custom manufacturing
• Trademark: Raytek
• Origin: China
• HS Code: 9002909090
• Production Capacity: 100000PCS Per Year

Product Description

General introduction:Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit component structures on the silicon wafer, and become an IC with specific electrical functions. product. The original material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon with a purity of 99.999999999%.

Product Description:The starting material of the wafer is silicon. Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon with a purity of 99.999999999%. The polycrystalline silicon is melted, seed crystals are planted in the molten liquid, and then slowly pulled out to form a cylindrical monocrystalline silicon ingot. Since the silicon ingot is a seed crystal whose crystal plane orientation is determined It is gradually formed in the molten silicon raw material, and this process is called "crystal growth". The silicon ingot is then cut into sections, rolled, sliced, chamfered, polished, laser engraved, and packaged to become silicon wafers, which are "wafers".
Main Cooperation Materials Manufacturers:
CORNING, OHARA, SCHOTT, LEONI, AGC,HELLMA, NIKON,VITRON,C-LASER,ETC

Main Export Countries & Areas:
Usa, Uk, Japan, Germany, Spain, France, Swiss, Korea, Russia, Pakistan, India, Portugal, Canada, New Zealand, Australia, Saudi Arab, Turkey, Finland, Poland ,etc.

Raytekoptics Extra value added services offered:
1). Optical workcraft & process solution design;
2). Rough processing raw materials;
3). Semi finishing raw materials;
4). Fabricate custom sizes and shapes;
5). Design and supply custom coatings;
6). Modify and resurface customer supplied materials;
7). Drill holes, notch glass and provide beveled substrates;
8). Precision polish optics with non-standard aspect ratios;

Payment Method: by T/T or Western Union.
Delivery time: 7-10 days.
Quality Warranty: Ruitaiphotoelectric(Raytekoptics) offers quality warranty for our optics products with "3R" policy. For any inferior-quality products, Ruitaiphotoelectric(Raytekoptics) is responsible for return, replacement and refund.