Lapping& Polishing Machine/Grinding and Polishing Machine/Milling Machine/Machine Tool

• Customization: Available
• After-sales Service: Free Warranty Period
• Warranty: One Year
• Model NO.: RAYTEK LP-60A & 60B & 60C
• Type: Tool Grinding Machine
• Processing Object: Curve
• Abrasives: Grinding Wheel
• Controlling Mode: CNC
• Automatic Grade: Automatic
• Cylindrical Grinder Type: Universal Cylindrical Grinder
• Precision: High Precision
• Certification: GS, CE, RoHS, ISO 9001
• Condition: New
• Weight: 300kg
• Lapping Plate Speed: 5-100rpm
• Max. Lappingg and Polishing Wafer Size: 6 Inches (152.4mm)
• The Swing Amplitude of The Swing Arm: Adjustable From 0 to 15 Degrees
• Transport Package: Wooden
• Specification: 1200*1000*1800mm
• Trademark: RAYTEK
• Origin: China Shanghai
• HS Code: 8464901900
• Production Capacity: 500piese/Year
• Package Size: 130.00cm * 120.00cm * 200.00cm
• Package Gross Weight: 450.000kg

Product Description

 

Product Description

Welcome to learn about our RAYTEK high-end wafer grinding and polishing machine, designed specifically for the semiconductor and microelectronics manufacturing industries. It integrates high-precision grinding and polishing technology and is an ideal choice for improving wafer surface quality and achieving micro nano level processing. This product integrates multiple innovative features aimed at improving production efficiency, ensuring machining accuracy, and simplifying operational processes. It is an essential key equipment in modern advanced manufacturing processes.
Application area 

1. Semiconductor manufacturing: used for surface leveling in wafer pre-processing to ensure the manufacturing quality of components such as transistors and integrated circuits.
2. Micro electromechanical systems (MEMS): Fine machining of microstructure surfaces to improve the performance and reliability of sensors, actuators, and other devices.
3. Optoelectronic materials: Processing high-precision material surfaces such as optical components and laser substrates to enhance optical performance.
4. Materials science research: plays an important role in the fields of material surface modification, pre-treatment of thin film deposition, etc.

Our Advantages

 

1. 1,2,3 workstations for optional, capable of grinding and polishing samples up to 6 inches in size;
2. The equipment has a timing function, which can set the working time range for grinding and polishing, and automatically stop at the designated time;
3. The device has wireless transmission function for wafer thickness monitoring, and the machine can automatically stop after reaching the set target thickness reduction;
4. The grinding disc has a speed of 0-100rpm and is digitally controlled by a microcomputer. The parameters are set and controlled through a touch display interface speed;
5. The equipment is equipped with two peristaltic pumps, which can accurately control the uniformity of feeding and adjust the flow rate of material droplets through the peristaltic pump size;
6. The grinding and polishing fixture has a pressure adjustment function, which can adjust the working pressure of the fixture according to work needs;
7. The grinding and polishing process can be stored, and the process can maintain consistency and repeatability.

The lapping clamping fixture is a device that adsorbs a substrate with a wafer attached to the substrate to achieve flatness and removal control through grinding and polishing
A type of fixture mainly composed of vacuum adsorption unit, pressure regulating unit, data display unit, etc.

Product Parameters

 

Max. Lappingg and polishing wafer size	6 inches (152.4mm)
Lapping Plate Speed	5-100rpm
Dripping Speed	1-100ml/min uniformly adjustable
Double Peristaltic Pump Feeding
The swing amplitude of the swing arm	adjustable from 0 to 15 degrees
The swing speed of the swing arm is uniformly adjustable
Full LCD screen control.
Wafer grinding and polishing accuracy below 2 inches ± 1 micrometer
3-inch wafer polishing accuracy ± 2 microns
4-inch wafer polishing accuracy ± 3 microns
5-inch wafer polishing accuracy ± 4 microns
6-inch wafer polishing accuracy ± 5 microns

After Sales Service

Professional installation training: Provide on-site installation, debugging, and operation training services to ensure that equipment is quickly put into production.

• • After sales technical support: 24-hour online customer service, quick response to customer questions and needs, providing professional technical support.
  • Regular maintenance: Provide regular equipment inspection, maintenance, and upkeep services according to customer needs, extend equipment service life, and maintain optimal operating conditions.
  • Process optimization consulting: Based on rich industry experience, we provide process optimization consulting to customers, helping them improve product quality and production efficiency.

Choosing the RAYTEK wafer grinding and polishing machine is choosing a path towards high-precision, high-efficiency, and high reliability processing. We look forward to working together with you to create a brilliant future in microelectronic optical manufacturing!