Overview:
Sapphire crystals have high hardness, good light transmittance, good thermal conductivity, electrical insulation, mechanical properties, stable chemical properties, wear resistance, and wind erosion resistance. It can be used as high-strength window materials in civil and military fields, dielectric materials for microwave resistance tubes, ultrasonic conduction components, delay lines, waveguide laser cavities, and optical components and mechanical structural components such as precision instrument bearings, crucible materials, balance blade, etc.
The sapphire substrate and sapphire window are all made of optical primary crystal materials, and the raw materials are all 99.999% high-purity single crystal (Al2O3). The high-quality sapphire chips produced can be directly applied to the epitaxial growth of various semiconductor thin films. Our sapphire chips have excellent surface roughness, flatness, and cleanliness. Sapphire window products have good transmittance and reflectivity, making them suitable for various applications of sapphire optical windows.
Sapphire crystals are all grown using the Kyropoulos method, and the surface of the crystal rod is a ground surface that can be directly used or further processed by cutting, grinding, polishing, etc.
Features:
1. Sapphire has a high optical transmittance, making it widely used as a dielectric material for microelectronic tubes, ultrasonic conductive components, waveguide laser cavities, and other optical components. It is also used as a window material for infrared military devices, aerospace vehicles, high-intensity lasers, and optical communication.
2. Sapphire has the characteristics of high hardness, high strength, high working temperature, wear resistance, and corrosion resistance. Therefore, it is commonly used in harsh environments, such as precision manufacturing of boiler water meters (high temperature resistance), commodity barcode scanners, bearings (wear resistance), coal, natural gas, etc., as well as oil well detection sensors and detector windows (anti-corrosion).
3. Sapphire has the characteristics of electrical insulation, transparency, good thermal conductivity, and high hardness, and can be used as a substrate material for integrated circuits such as LEDs, microelectronic circuits, and ultra-high speed integrated circuits.
Using 99.999% high-purity single crystal Al2O3 optical primary material.
Special CMP (Chemical Mechanical Polishing) technology to ensure its low-cost performance.
All crystal orientations have excellent surface quality (surface roughness of C surface is less than 0. 2 nm), A, M, R, N, V, 10-14, etc. are less than 0.5 nm
Clean with ultrapure water of 18M Ω * cm or more in a 100 level purification room to ensure excellent cleanliness on the surface of each chip.
25 pieces/box or single piece box packaging can maximize customer research flexibility.
Each chip has a product serial number for subsequent traceability.
Reasonable and compact cardboard packaging can facilitate safer transportation and save costs.
Standard specification chips are generally available in stock to ensure fast delivery.
Application area:
1. Semiconductor LED industry (MOCVD epitaxial GaN substrate)
Generally speaking, this field uses C-sided (0001) sapphire. The R plane (1-102) or M plane (10-10) is mainly used for growing non-polar/semi polar planar epitaxial layers to improve luminescence efficiency.
2. Growth of III-V or II-VI compound semiconductors. For example: gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), etc.
3. Microelectronic IC applications, especially ultra high speed integrated circuits (SOS), are generally a type of heteroepitaxial silicon on R-plane (1-102) sapphire chips.
4. Hybrid microelectronics: Hybrid microelectronics products mainly include HIC and MCM, which have high requirements for substrates. Sapphire substrates have the characteristics of stable dielectric constant and low dielectric loss, making them the most commonly used substrate for HIC and the main substrate for MCM. A-sided (11-20) sapphire substrates are usually used.
Processing process:
1. The processing process of sapphire crystal rods
- Long crystal: Growth of large-sized and high-quality single crystal sapphire crystals through a long crystal furnace.
- Orientation: Ensure that the sapphire crystal is in the correct position on the rod removal machine for easy rod removal processing.
- Pulling out a sapphire crystal rod from sapphire in a specific way.
- Grinding: Use an external cylindrical grinder to grind the outer circle of the crystal rod to obtain accurate dimensions.
- Quality inspection: Ensure the quality of the crystal rod and whether the size and orientation of the extracted crystal rod meet customer requirements.
2. Processing process of sapphire wafers
- Orientation: Accurately position the sapphire crystal rod on the slicer for precise slicing.
- Slicing: Cut the sapphire crystal rod into thin chips.
3.Grinding: Grinding chips to remove scratch layers and improve their flatness.
4.Chamfer: Trimming the edges of the chip into a circular arc shape to improve the mechanical strength of the thin edge and avoid defects caused by stress concentration.
5.Polishing: Reduce the roughness of the chip to achieve the precision of epitaxial growth on its surface.
6.Cleaning: Clean the surface of the chip from pollutants (such as fine dust, particles, metal organic stains, etc.) in a level 100 purification room.
7.Quality inspection: Use high-precision instruments to inspect chips and ensure they meet customer usage requirements.
Serve:
Global leading enterprise in the field of sapphire technology and scale, with the growth technique and technology of large-sized sapphire crystals reaching the international leading level.
- We can provide customized sapphire lens services according to the special needs of customers to meet their personalized needs.
- Return and exchange service: If customers need to return or exchange products due to product specifications, models, or other reasons, we will handle them in accordance with the company's return and exchange policy to ensure that the customer's rights are protected.
Other:
Main Export Countries & Areas:
USA UK Japan, Germany, Spain, France, Swiss, Korea, Russia, Mexico, Brazil, Argentina Pakistan, India, Portugal, Canada, New Zealand, South Africa, UAE, Egypt, Norway, Netherland, Russia, Australia, Saudi Arab, Turkey, Finland, Poland ,etc.
Payment Method: by T/T or Western Union or L/C
Delivery time:2 weeks.
Quality Warranty: Shanghai Z printing offers quality warranty for our lasers products with "3R" policy. For any inferior-quality products, Z printing company is responsible for return, replacement and refund.
For specific installation and operation, please refer to the product manual or contact customer service for operation tips or videos after receiving the product. The equipment is guaranteed for one year, and artificial or abnormal damage is not covered by the warranty. If it exceeds one year, a certain fee will be charged for the relevant after-sales service. This device will continue to be optimized and improved due to various factors. At that time, please pardon us not notify separately. Thank you for your support and understanding.
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