• The Graphite Disk for Mocvd
  • The Graphite Disk for Mocvd
  • The Graphite Disk for Mocvd
  • The Graphite Disk for Mocvd
  • The Graphite Disk for Mocvd
  • The Graphite Disk for Mocvd

The Graphite Disk for Mocvd

Application: Temperature Measurement
Batch Number: 2023+
Certification: RoHS
Manufacturing Technology: Discrete Device
Material: Compound Semiconductor
Model: ST
Customization:
Diamond Member Since 2021

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Rating: 5.0/5
Manufacturer/Factory

Basic Info.

Model NO.
Raytek-ZN001
Package
CSP
Signal Processing
Analog Digital Composite and Function
Type
Intrinsic Semiconductor
Round Disk
D50mm*3
High Temperature Durability Durability
Excellent Thermal Shock Resistance
Excellent Acid Resistance
1000USD
Transport Package
Seperate Package
Specification
as requested
Trademark
Raytek
Origin
China
HS Code
38019090
Production Capacity
50000/Year

Product Description

The Graphite Disk for Mocvd The product is used in crystal-growing in Sic,EPI,Sic and PVT with the below advantage:

 1.Pefect high temperature durability     
 2.Excellent thermal shock resistance 
 3.Excellent acid and alkali corrosion
 4.Prevent the discharge of the plated matrix particles
 5.The air tightness is excellent and covers all the micropores of the substrate
6. It has strong resistance to oxidation /silicification in high-temperature 

                                                                                      D.SiC Physics characteristic 
 
Description  Unit Parameter
Density g/cm3 3.2
Crystal type   β-SiC
Hardness HK 2800
Bending strength Mpa 170
Yang's Modulus Gpa 320Gpa
Room temperature bonding force Mpa >8Mpa
size mm 0~2400
thickness um 10~1000
thermal conductivity W/(m.K) 290
surface infrared reflectivity  % 23
depositable substrate    reaction sintering  silicon carbide recrystalline carbonization 
 silicon non-pressure sintered silicon carbide Graphite
  D. Pyro physics charateristics  
Description Unit Parallel to the coating surface Perpendicular to the coating surface
Density Mg/m 2.2 2.2
Hardness HSD 100 -
Resistance rate μΩ·m 2.00-4.00 2~5x10
Thermal expansion coefficient RT-500ºC 105/K <2.2 28
Tensile strength Mpa 110 -
Yang's module Gpa 30 -
Thermal conductivity rate W/(m·K) 170-420 3
Permeability % - 0
Surface infrared reflectivity % - 50

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