Supporting Ring for Semiconductor Crystal-Growing

Product Details
Customization: Available
After-sales Service: Technical Support
Warranty: 2years
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Registered Capital
11600000 RMB
Plant Area
>2000 square meters
  • Supporting Ring for Semiconductor Crystal-Growing
  • Supporting Ring for Semiconductor Crystal-Growing
  • Supporting Ring for Semiconductor Crystal-Growing
  • Supporting Ring for Semiconductor Crystal-Growing
  • Supporting Ring for Semiconductor Crystal-Growing
  • Supporting Ring for Semiconductor Crystal-Growing
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Basic Info.

Model NO.
Raytek-ZN004
Transport Package
Fine Package
Specification
as requested
Trademark
Raytek
Origin
China
HS Code
38019090
Production Capacity
50000/Year

Packaging & Delivery

Package Size
50.00cm * 30.00cm * 20.00cm
Package Gross Weight
1.000kg
Lead Time
10 days (1 - 1 Pieces)
To be negotiated ( > 1 Pieces)

Product Description

Supporting Ring for Semiconductor Crystal-Growing
Our products have been verified in batches by many well-known 8-12 inch semiconductor customers and it is used in crystal-growing in Sic,EPI,Sic and PVT with the below advantage:

 1.Pefect high temperature durability     
 2.Excellent thermal shock resistance 
 3.Excellent acid and alkali corrosion
 4.Prevent the discharge of the plated matrix particles
 5.The air tightness is excellent and covers all the micropores of the substrate
6. It has strong resistance to oxidation /silicification in high-temperature 

 
D.Pyro physics characteristic
Density Mg/m 2.2 2.2
Hardness HSD 100 -
resistivity μΩ·m 2.00-4.00 2~5x10
Thermal expansion coefficient RT-500ºC 105/K <2.2 28
Tensile strength Mpa 110 -
Yang's modulus Gpa 30 -
thermal conductivity W/(m·K) 170-420 3
Breathability % - 0
Surface infrared reflectivity % - 50
D.Sic physics characteristics
Descreption Unit Parameters
Density g/cm3 3.2
crystal type   β-SiC
hardness HK 2800
bengding resistance Mpa 170
Yang's module Gpa 320Gpa
Binding force of room temperature and coating Mpa >8Mpa
possible size mm 0~2400
depositionable thickness  um 10~1000
Termal conductivity  W/(m.K) 290
surface infrared reflectivity % 23
Depositionalbe substrat   Sintered-silicon-carbide recrystallization and carbonization
silicon non-pressure sintered silica carbide

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